Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging
نویسندگان
چکیده
Abstract This review introduces relevant nanoscale thermal transport processes that impact abatement in power electronics applications. Specifically, we highlight the importance of mechanisms at each layer material hierarchies make up modern electronic devices. includes those through: (1) substrates, (2) interfaces and two-dimensional materials, (3) heat spreading materials. For layer, provide examples recent works demonstrate improvements performance and/or improve our understanding relevance across junctions. We end discussion by highlighting several additional applications have benefited from a consideration phenomena, including radio frequency (RF) neuromorphic computing.
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ژورنال
عنوان ژورنال: Journal of Electronic Packaging
سال: 2021
ISSN: ['1528-9044', '1043-7398']
DOI: https://doi.org/10.1115/1.4049293